Executive summary

Escalating health and environmental concerns regarding per- and polyfluoroalkyl substances (PFAS), or ‘forever chemicals’, have prompted calls for stricter regulation. The EU has proposed a universal ban on PFAS in all products. This report identifies that the electronics industry is not as dependent on PFAS as commonly assumed. Many applications linked to thermal stability or low dielectric constants already have technically feasible and commercially available alternatives.

Why is this report important?

The report serves as evidence that European industry can adapt rapidly to a PFAS ban. It challenges the claims made by legacy polluters who often exaggerate the difficulties of substitution. By detailing available PFAS-free electronic components, the research demonstrates that the transition offers an opportunity for innovation and competitive advantage for proactive companies.

Printed circuit boards

PFAS, particularly PTFE, are used in printed circuit boards (PCBs) for their electrical properties. However, PTFE’s slipperiness makes bonding with copper difficult and expensive. PFAS-free alternatives are now widely available, such as Rogers Corporation’s RO4000 series, including the RO4830 Plus launched in March 2025. Isola Group offers the Astra range and Tachyon 200JV, both designed to replace PTFE with lower manufacturing costs. Additionally, Advanced Chip and Circuit Materials (ACCM) introduced its Celeritas range in January 2025 for ultra-high-speed PCBs. These non-PFAS materials are compatible with standard FR-4 fabrication processes.

Insulation of components

PFAS serve as speciality insulation for niche electronic components requiring high thermal stability and chemical inertness. However, major producers are transitioning to PFAS-free materials. onsemi has declared its products PFAS-free, while Knowles identified several PFAS-free capacitor ranges in 2025. Taiyo Yuden has also transitioned its inductors and ferrite power inductors to PFAS-free resins, ensuring that quality levels remain consistent with existing products.

Anti-drip agents

PFAS are habitually used as anti-drip agents in thin-wall plastics to achieve fire safety ratings. LG Chem developed No Intentionally Added (NIA) PFAS technology, such as LUPOY ER5001PN plastic, for use in smartphones and laptops. Trinseo launched its PFAS-free EMERGE 8600PR formulation for Asian and European markets. Other suppliers like Covestro, Sabic, and Mitsubishi offer polycarbonate resins that achieve high flame resistance without intentionally added PFAS, often using silica-based alternatives.

Coatings and films

Passivation layers and conformal coatings are essential for protecting PCBs from contaminants. Nordic Semiconductor announced a transition to PFAS-free polyimide passivation from Fujifilm in 2024. Start-ups and global companies like actnano, P2i, and Plasmalex provide PFAS-free coatings that meet or exceed the performance of fluoropolymer-based competitors. actnano’s Advanced nanoGUARD offers thin-film protection without negatively affecting signal integrity or thermal performance.

Wires, cables and connectors

While PFAS are used for high-frequency data transmission, alternatives like cross-linked polyethylene (XLPE) and polyetheretherketone (PEEK) are effective. BASF marketed its Ultrason range of cable insulation for AI applications in October 2026. Igus produces chainflex cables that are largely PFAS-free, and Allectra developed a proprietary process for PFAS-free polyimide-insulated wires. Habia has successfully replaced fluoropolymers with polyesters and PEEK for a significant share of industrial applications.

Coatings for displays and lenses

Replacing PFPE-containing anti-fingerprint (AF) coatings is challenging but feasible using alkylsilanes and organosilanes. Kriya Materials utilises an inorganic-organic nanocomposite platform to eliminate PFAS entirely while maintaining optical transparency. CCM’s 7675 Duo Glass-Metal coating and Nanize’s polysilazane-based nano-coatings offer durable anti-soiling and anti-scratch properties. These technologies are already being validated or used by major electronics manufacturers.

Vent filters

Microporous membranes for acoustic vents often rely on PTFE for hydrophobicity. SAATI manufactures the SAATivent series of PFAS-free acoustic vents using electrospinning technology. SABEU offers TRAKETCH, a range of PFAS-free microporous membranes that protect sensitive electronics from external impact and moisture. These alternatives maintain application-specific sound quality and withstand the high temperatures required for soldering.

Heat transfer fluids

PFAS-based liquid cooling represents less than 1% of global data centre cooling. ZutaCore pledged to bring a PFAS-free direct-on-chip cooling solution to market in 2026. Microsoft has developed a direct-to-silicon microfluidic approach using water and propylene glycol, which removes heat more efficiently than typical cold plates. TSMC unveiled a similar solution in 2025, using de-ionised water as a coolant, with commercial deployment targeted for 2027.

Conclusion

The research demonstrates that substitution is primarily a knowledge problem rather than a technical one. PFAS-free alternatives are widely available for most electronics applications. Granting lengthy regulatory derogations for legacy producers allows the continued accumulation of PFAS in the environment and punishes innovative companies. A universal PFAS restriction would provide the necessary incentive for industry to complete the transition to safer materials.